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arCuDia / SbS-Dia.

Heat spreader for extreme applications

  • Dimension
  • - Width : ~ 108mm
  • - Length : ~ 108mm
  • - Thickness : ≥0.7 mm
  • Features
  • - Patented unique Structure
  • - Hole, Ear, Rectangular type
  • - Surface finishing : Cu, Ni, Au
  • - Ag-Brazing (800℃) is available
  • - Copper-Carbon New Composite Materials
  • - Heat spreader with strain balanced structure
  • - high performance heat dissipation substrates with higher TC and lower CTE
  • - The world's highest performance heat dissipating substrate for semiconductor packages
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