Cu-Diamond CPU package
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작성자 TGS
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26-02-11
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Next-Generation Semiconductor Packaging Equipment and Materials Industry Exhibition (ASPS) 2023
We will be exhibiting at the international exhibition held at Suwon Convention Center from August 30th to September 1st.
This time, we've prepared a new product: TGS's Cu-Diamond CPU package. For more details, please see the attached materials.
- Prev Next-Generation Semiconductor Packaging Equipment & Materials Industry Exhibition (ASPS) 2023 26.02.11
- Next 2023 Exhibition 26.02.11