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Announcement of the 2025 Nano Convergence Technology Institute Project Excellence Achievement Selection Promotion Event

TGS — 2026-02-11T14:45:18+09:00

At the 2025 Nanotechnology Research Institute (NRI) Senior Expert Utilization Project Performance Exchange Meeting,

TGS's "Development of a Metal-Carbon Composite DBC High-Heat Dissipation Component with a Thermal Conductivity of 600 W/m·K" was introduced as an outstanding project and presented.

- Project Title: Development of a Metal-Carbon Composite DBC High-Heat Dissipation Component with a Thermal Conductivity of 600 W/m·K

- Host Organization / Principal Investigator: NRI · Cha Ho-il, Principal Investigator

- Participating Organization / Participating Researcher: The Good System (TGS) · Lee Seok-woo, CTO

- Event Date: December 10, 2025

- Venue: Future Hall, 9th Floor, NRI

At this exchange meeting, the project's technological progress and achievements were presented,

and future development directions were discussed with experts.

TGS will continue to do its best to achieve results from this research.

TGS participates in the 2025 Small Business and Enterprise Technology Fair, co-hosted by the Carbon Nano Association.

TGS — 2026-02-11T14:44:23+09:00

TGS participated in the "2025 Materials, Components, and Equipment Root Technology Fair (Tech Inside Show 2025)" held at KINTEX

in Ilsan from October 29th (Wednesday) to 31st (Friday), 2025, hosted by the Korea Institute for Advancement of Technology (KIAT)

and co-hosted by the Korea Carbon Nano Industry Association.

At this exhibition, TGS showcased its Cu–Diamond (arCuDia) heat dissipation substrate,

which garnered significant attention from experts and visitors from various industries.

This exhibition was a meaningful opportunity to share the key achievements of companies working on mass production performance enhancement projects

and to showcase their technological competitiveness in the field of high-heat conductive materials.

TGS will continue to lead the global market with innovative heat dissipation material technologies.

IMS2025 Exhibition

TGS — 2026-02-11T14:43:31+09:00

TGS successfully exhibited at IMS2025, drawing visitors from across the U.S. and around the world.

Our new product, CD-Core, attracted strong interest.

Visitors highlighted its excellent heat dissipation performance and real-world potential.

A heartfelt thank you to everyone who visited our booth.

TGS Products Line-up 2025

TGS — 2026-02-11T14:42:36+09:00

Discover the latest TGS Products Line-up 2025! Download our catalogs to explore our innovative solutions:

1. TGS Product Applications 2025 – Industry applications overview
2. TGS CVD-Diamond Line-up 2025 – Advanced CVD-diamond solutions

Stay ahead with TGS’s latest technology and solutions for 2025!

Participation Report for EuMW2024

TGS — 2026-02-11T14:38:43+09:00

TGS proudly participated in the European Microwave Week (EuMW2024) held from September 22nd to 27th, 2024.

This exhibition brought together leading companies and experts worldwide to share the latest RF and microwave technologies and innovations.

Our goal was to showcase our latest product, arCuDia, understand industry trends,

and strengthen our communication with customers and partners through this event.

We want to express our gratitude to everyone who supported our participation in EuMW2024.

Our company remains committed to continuous innovation and technology development to provide better customer service.

Thank you!

IMS2024 Exhibition

TGS — 2026-02-11T14:37:39+09:00

The IMS2024 exhibition concluded successfully.

We had the opportunity to meet our global customers in person, introduce TGS to the world, and have meaningful conversations.

Thank you for taking the time to visit our booth!

Cu-Diamond Laser Heat Spreader

TGS — 2026-02-11T14:36:28+09:00

Sharp edge machining for laser application

Next-Generation Semiconductor Packaging Equipment & Materials Industry Exhibition (ASPS) 2023

TGS — 2026-02-11T14:35:10+09:00

At ASPS, held at the Suwon Convention Center from August 30 to September 1, 2023,

we showcased our new Cu-Diamond CPU Package, successfully completing the three-day exhibition, garnering significant attention.

Thank you for taking the time to visit us.

Cu-Diamond CPU package

TGS — 2026-02-11T14:34:26+09:00

Next-Generation Semiconductor Packaging Equipment and Materials Industry Exhibition (ASPS) 2023

https://www.semipkgshow.com/

We will be exhibiting at the international exhibition held at Suwon Convention Center from August 30th to September 1st.

This time, we've prepared a new product: TGS's Cu-Diamond CPU package. For more details, please see the attached materials.

2023 Exhibition

TGS — 2026-02-11T14:33:56+09:00

We successfully completed the four exhibitions scheduled for the first half of 2023.

We were fortunate to receive many visitors, particularly those showing interest in our Cu-Diamond products.

It was a global event, starting in Japan, then moving on to Germany, Israel, and the United States.

We would like to once again express our gratitude to everyone who visited.

1,000 W/mK, arCuDia

TGS — 2026-02-11T14:33:09+09:00

Launch of Cu-Diamond new product of 1,000 W/mK, arCuDia

Exhibitions in 2023

TGS — 2026-02-11T14:32:56+09:00

Welcome to TGS booth for the exhibitions.
The GoodSystem (TGS) succeeds in high-performance heat spreaders for semiconductor packages with Cu-Diamond metal composite materials

IMS 2022 Exhibition was successfully finished. Thank you for your attention!

TGS — 2026-02-11T14:32:17+09:00

IMS 2022 Exhibition was successfully finished. Thank you for your attention!

Exhibition Information

TGS — 2026-02-11T14:30:40+09:00

5th Tips Meetup 'Post Tips' IR Presentation (The Good System: Thermal Materials for Semiconductor Packages for Wireless Communications and Electric Vehicles)

TGS — 2026-02-11T14:27:34+09:00

Watch the presentation video

The Good System Co., Ltd.

https://www.youtube.com/watch?v=1luOi0N0UqY

Korea Angel Investment Association

Subscribers: 2.22 million

Event Name: 5th Tips Meetup 'Post Tips'

Date: Thursday, March 10, 2022, 3:00 PM - 5:00 PM

Participants: 5 Post Tips companies

Main Content: IR Presentations by Tips Startups

IR Presentations (3:00 PM - 5:00 PM)

1) NuriBio: Genetic Analysis Platform Technology (Cancer Diagnosis through Liquid Biopsy)

2) The Good System: Thermal Materials for Semiconductor Packaging for Wireless Communications and Electric Vehicles

3) Store Camera: Online Seller App Based on Product Photography

4) PhiBioMed: Smart Nanomedicine/Smart Contact Lenses

5) iTed: Transparent Heat Wire Technology Using Conductive Nanomaterials